3D printing and silicon photonics have combined in a rather exciting way this week. Researchers at MIT have engineered a novel 3D printing design on a single computer chip, officially the world's ...

New vertical device architecture promises stable, ultra-dense semiconductor stacking for future AI and high-performance ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Researchers developed a dual-modulated vertical transistor that suppresses leakage at nanoscale channels and supports ...

Researchers developed a dual-modulated vertically stacked transistor that eliminates current leakage at nanoscale channel lengths, advancing low-power 3D chip integration.

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

Life Sciences / Bio: ROCS X is an AI-enabled virtual screening solution that enables scientists to conduct 3D searches of over 200 trillion drug-like molecules. Target X is a physics-based AI solution ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip ⁠designer ⁠Broadcom said that it expects to ⁠sell at least 1 million chips by 2027 based on its stacked design tech, an executive ...