Intel’s 3D transistors are no small feat. Some are calling it a breakthrough that will allow Intel to continue to make chips that adhere to Moore’s Law (i.e. the number of transistors that can be ...

Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...

Next year looks set to be busy for Intel as the chip giant as it prepares to power not only the next generation of PCs, but also a whole raft of other smart devices, ranging from high-tech consumer ...

Intel is preparing its own chip-stacking technology to rival AMD’s "3D V-cache" tech, according to CEO Pat Gelsinger. But don’t expect Intel to take the same chip-stacking approach as AMD, which has ...