Ansys (ANSS) electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications / Key Highlights Ansys collaboration to expand ...

Ansys (ANSS) artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasks ...

application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys' physics solver results through real-time visualization. Ansys is ushering in the next generation of ...

Latest release fuels collaboration and digital transformation by connecting workflows, integrating AI, and optimizing complex design tasks / Key Highlights Unified Ansys technology reduces the need ...

Modern Ansys Design Language elevates the user experience (UX) to create a new user interface (UI) paradigm across the Ansys multiphysics portfolio and increases accessibility Native Ansys software ...

Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...

PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology, which uses ...