ASML is looking at expanding from front-end litho into packaging, according to CTO Marco Pieters (pictured).

Our Dutch pride ASML is preparing a significant EUV throughput uplift that could reshape the cost math of advanced ...

The company's next moves include building machines for advanced chip packaging and exploring ways to produce even larger silicon dies, shifting ASML from its narrow role ...

By Max A. Cherney SAN JOSE, California, March 2 (Reuters) - ASML Holding has ambitious plans to expand its line of chipmaking ...

ASML has delivered a first-generation Twinscan EXE:5000 High-NA extreme ultraviolet (EUV) lithography scanner to Intel, seven years after Intel first ordered the machine. The High numerical aperture ...

It's called NanoFab Reflection. It's expected to cost $614 million to build and is part of a $10 billion computer chip research center plan announced by Gov. Kathy Hochul in December 2023.

ASML (ASML) plans to expand its chipmaking equipment portfolio with new products to capture more of the growing market for AI chips.

ASML's exposure systems are expected to expose around 50 percent more wafers by 2030 than before. This requires complex ...

A new technical paper titled “Controlling Speckle Contrast Using Existing Lithographic Scanner Knobs to Explore the Impact on Line Width Roughness” was published by researchers at Samsung, ASML and ...

ASML has unveiled an extreme ultraviolet (EUV) upgrade that could raise chip output per scanner by up to 50% by 2030, without expanding cleanroom space or adding new tools.