Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand Process Technology ...

Richard P. Wallace, CEO, outlined that "KLA's results were strong across the board, and we were at or above the high end of our guidance ranges. Specifically, revenue was $3.175 billion. Non-GAAP ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

China on track to account for nearly half of world wafer capacity in two years, organiser of world's largest chip industry ...

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while ...

GlobalFoundries plans a new advanced packaging center in New York for U.S.-made semiconductor chips, supported by state and federal funding. GlobalFoundries has announced plans to establish a new ...

That’s where IC packaging comes in. It’s like the housing for your phone or the case for your computer – it does a lot more ...

TSMC's 3nm supply exceeds demand right now, with major US tech companies including AMD, Apple, NVIDIA, Qualcomm, and more have full production capacity, with orders expected to be filled through to ...