WESTBROOK, ME—Systems integrator Lanco has been awarded a contract to design and build an automated, pallet-based test system for high-volume production of a medical device.
The Type b, class 1, 19207-12465333 cleaning specification verifies assemblies’ compliance with the US Army Land Vehicle Maintenance Regulations’ environmental and electrical requirements, and is a ...
VLC Photonics, a renowned photonic integrated circuit (PIC) design and test house (part of the Hitachi High-Tech Group), and ficonTEC, a leading provider of automated assembly and test production ...
DONG GUAN, GUANGDONG, CHINA, January 19, 2026 /EINPresswire.com/ — In today’s highly interconnected world, cable assembly and wire harness solutions form the ...
Many reports place PIC market growth at a CAGR1 of over 20% until 2025 and even beyond. Because of this, superior automation for both assembly and testing is critical in enabling high-volume ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
The objective of this research is to improve scheduling decisions in high-mix low-volume (HMLV) production environments. Unique characteristics of HMLV semiconductor assembly and testing operations ...
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