To reduce die size by up to 40 percent, Erfurt, Germany-based analog/mixed-signal foundry X-FAB Semiconductor Foundries AG Tuesday announced XT06, its 0.6-micrometer silicon-on-insulator (SOI) CMOS ...
X-Fab Semiconductor Foundries AG is now offering its 0.6-micron CMOS process for high-voltage applications such as embedded non-volatile memory. The mixed-signal technology, for applications up to 40V ...
The Brazilian government and X-FAB Silicon Foundries have signed an agreement to bring semiconductor manufacturing to Brazil. Brazil's government-backed Excellence Center for Advanced Electronic ...
A technical paper titled “A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones” was published by researchers at Texas A&M University. “CMOS Image ...
Fabless semiconductor company Luxtera announced today that it has solved the longstanding problem of building advanced photonic interfaces into mass-produced silicon chips. The company claimed that, ...
A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
Engineers at IBM Research are claiming to have built the world's most advanced graphene-based computer chip, with performance that's 10,000 times better than previous graphene ICs. The key to the ...
An innovative design by Motorola's Sensor Products Division in Tempe, Ariz., optimally integrates a surface-micromachined capacitive automotive tire-pressure sensor with a 0.8-µm CMOS double-metal, ...
The ongoing lockdown in Malaysia is posing new variables to capacity deployments at many international automotive IDMs, further fueling competitions between ICT and auto makers for... X-Fab Silicon ...
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