Micron confirms AI-optimized memory and storage technologies are in production - HBM4 memory, SOCAMM2, and PCIe Gen6 SSDs - read for NVIDIA Vera Rubin.

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...

AI infrastructure can't evolve as fast as model innovation. Memory architecture is one of the few levers capable of accelerating deployment cycles. Enter SOCAMM2 ...

Smart memory node device from UniFabriX is designed to accelerate memory performance and optimize data-center capacity for AI workloads. Israeli startup UniFabriX is aiming to give multi-core CPUs the ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

On Tuesday, Apple introduced M5 Pro and M5 Max, debuting a dual-die Fusion Architecture that pushes Apple Silicon further into AI-heavy professional workflows on the latest MacBook Pro. Here's how.