TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...
A new method of nickel-gold plating uses chemicals rather than the more-commonly used electricity-based approach of passing electric current between a substrate and conductive solution. The new ...
Dublin, Feb. 20, 2024 (GLOBE NEWSWIRE) -- The "Ceramic Substrates Market by Product Type (Alumina, Aluminum Nitride, Silicon Nitride, Beryllium Oxide), End-use Industry (Consumer Electronics, ...
(Nanowerk News) In recent times, humans have faced the threats of global warming and depletion of energy resources. In Japan, about 40% of the greenhouse gases generated due to energy consumption are ...
AZoM speaks to Empower Materials to find out the A-Z of QPAC polymer binders in semiconductor and AlN fabrication.
Achieving high reliability and low cost package substrate compared with silicon interposer package Tokyo, December 11, 2015 --- Hitachi, Ltd. (TSE: 6501) and Hitachi Metals, Ltd. (TSE: 5486) have ...
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