The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...

T2M, today announced the commercial availability of its partner’s production-proven die-to-die interface IP core, aligned with the emerging UCIe ecosystem. This solution is already validated in mass ...

Chiplet PHY Designer 2025 from Keysight offers simulation capabilities for UCIe 2.0 and support for the Open Compute Project Bunch of Wires (BoW) standard. Tailored to AI and data center applications, ...

The semiconductor industry is moving out of the monolithic age of the system-on-chip (SoC). Instead of arranging every building block of IP on the same slab of silicon, the movers and shakers in the ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...

1. Nilesh Kamdar addressed simulation, interoperability testing, and managing chiplet data in his presentation. Artificial intelligence (AI) has become central to EDA design optimization and debugging ...

Keysight Technologies has unveiled Chiplet PHY Designer 2025, enhancing high-speed digital chiplet design with new interconnect standards support for AI and data centers. As the complexity of AI and ...

Forward-looking: Chipmakers are getting serious about splitting up complex chip designs across multiple smaller "chiplets." AMD is leading the charge, having already implemented multi-chiplet ...

System-on-chip design startup Baya Systems Inc. said today it has closed on $36 million fuding to support its operational growth and accelerate the development of its software portfolio to meet the ...

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which ...

Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...

Apple M5 Pro and M5 Max chips could debut at Apple’s upcoming event on March 4th and power the new MacBook Pro models. Both chips could offer more CPU and GPU cores, courtesy of a new chiplet design.