Researchers at Sandia National Laboratories and Auburn University have developed a new method to more accurately detect ...

Multi-die assemblies greatly increase the number of things that can go wrong, and the difficulty of finding them.

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

Computing is often celebrated for its precision and speed. But researchers and hyperscale data center operators are warning of a growing threat that challenges one of computing’s core promises: ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...