The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne. ...

Keeping an IC cool takes on new meaning when power dissipation exceeds 150 watts. Innovative electrical and mechanical solutions to new wafer testing challenges continue to be developed. For example, ...

(NASDAQ: FORM), a leading provider of RF probe stations and probe cards, and Rohde & Schwarz, a global leader in test and measurement, today announced a strategic co-marketing partnership as part of ...

Although it requires a new generation of test equipment, testing MEMS devices is challenging but not impossible. Since the early days of the IC industry, wafer-level test has been possible using ...

FREMONT, CA / ACCESSWIRE / April 2, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer order ...

In this interview, Jeremy Hope from Wentworth Laboratories talks to AZoM about why they are attending electronica. Please tell us about the company Wentworth Labs and why you are attending electronica ...

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...

FREMONT, CA / ACCESSWIRE / January 5, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced it has ...