Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

Advanced BCD technologies use deep trench isolation (DTI) to optimize area and to suppress parasitic effects in bi-polar junction transistors (BJTs). However, DTI increases thermal resistance and self ...

Design verification has been the biggest challenge for any IC design company for decades now. EDA tools and verification methods have evolved a lot over the last two decades, but along with that, the ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

GUC engineers are using Ansys HFSS 3D Layout’s advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...

Solido™ Simulation Suite, (“Solido Sim” software) featuring AI-accelerated SPICE and FastSPICE engines, represents a significant leap forward in analog/mixed signal IC simulation technology, providing ...

SANTA CLARA, CA--(Marketwired - Aug 11, 2015) - Silvaco, Inc. today announced that China's Hangzhou Silan Integrated Circuit Co., Ltd (Silan-IC) has adopted its TCAD process and device simulation ...

The Turbo Package Analyzer TPA v5 IC packaging tool features a new automation, design flow, and simulation capability needed to extract the electrical characteristics of complex high-performance BGA ...