SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging with Formats up to 700×700mm to Leading U.S. Technology Company

FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...
Semiconductor Engineering

The Rise Of Panel-Level Packaging

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...
Hosted on MSN

Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
Reno Gazette-Journal

Silicon Box Ships 100M Units, Proves Advanced Panel-Level Packaging Ready for AI, HPC era

Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...
Semiconductor Engineering

New Panel Production Efforts Target Interposer Costs

The rising cost of increasingly large interposers is spurring renewed interest in panel-level manufacturing, which for years has hobbled along due to the massive and collective effort required by the ...