InP and SiPho join CMOS as critical technologies. Lasers, CPO and OCS will be everywhere (indium phosphide, silicon photonics ...
Designing automotive Advanced Driver Assistance Systems (ADAS) applications can be incredibly complex. State-of-the-art ADAS and autonomous driving systems use ‘sensor fusion’ to combine inputs from ...
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a major milestone in ...
At DesignCon 2026, Amphenol Communications Solutions showcased its XtremePass Co-Packaged Copper (CPC) interconnect system, ...
Advanced interconnect materials and technologies represent a pivotal aspect of modern integrated circuits, addressing both the miniaturisation of device architectures and the increasing performance ...
A collection of papers at this month's International Electron Devices Meeting (IEDM) illustrates the frantic work underlying the industry's gradual move toward a manufacturable 22-nm SOC. Work in ...
With the clean transmission of high-speed signals a key priority in today’s electronic products and systems, design engineers continue to face the task of designing and implementing interconnection ...
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