OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...

Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...

Packaging often stands as the first physical point of contact between a brand and its audience. While often overlooked or treated as an afterthought, package design reflects a brand’s attention to ...

Supporting circular packaging - Paper-based packaging tapes designed for recyclability and performanceBridging technical and creative applications - Enhancing both structural performance and design ...

Dezeen Competitions: The Salmon Packaging Design Competition tasks designers with creating innovative packaging using corrugated cardboard sourced from sustainable and renewable materials. The ...