Efficient Power Conversion Corporation extends its family of high-speed, high performance transistors with the EPC8010 power transistor. Sold in die form, the EPC8010 is a mere 1.75 mm2 with 100 VDS.
New vertical device architecture promises stable, ultra-dense semiconductor stacking for future AI and high-performance ...
Imec researchers have set a new benchmark in RF transistor performance for mobile applications. They present a gallium nitride (GaN) MOSHEMT (metal-oxide-semiconductor high-electron-mobility ...
The big picture: The global company showed how it plans to continue increasing transistor density over the next several years. It also believes that the semiconductor industry will transition to ...
(Nanowerk Spotlight) For over fifty years, the relentless miniaturization of silicon transistors has upheld Moore’s Law, delivering exponential leaps in computing power. However, this development ...
As TSMC and Intel head closer to direct competition discussions of transistor density and die size have become increasingly contentious. Such comparisons, however, are fatally flawed. Share on ...
Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Intel announced that its researchers foresee a way to make chips 10 times ...