Less than two decades after smartphones fit into the palm of our hands, artificial intelligence is now running on devices ...

Chipmakers face a difficult balancing act. Consumers want smarter devices with faster AI features, ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

(Application Note) Here is a new Application Note from Nanosurf on conductive AFM (C-AFM) measurements on a polished IC surface with multiple transistor contacts. Chemical-mechanical polishing (CMP) ...

The EPC8010 power transistor, sold in die form, measures 1.75 mm 2 with 100 VDS. Optimized for high speed switching, the device has a maximum R DS(on) of 160 mΩ and input gate charge in the hundreds ...

Use left and right arrow keys to seek audio. For roughly six decades, the semiconductor industry has followed a simple and reliable formula: make transistors smaller, pack more of them onto a chip, ...

New technical paper titled “Multi-functional multi-gate one-transistor process-in-memory electronics with foundry processing and footprint reduction” from researchers at Ningbo Institute of Materials ...

Transistors in some circuit configurations work together and, frequently, need to be matched. This is so common that you can sometimes find ICs that are just a pair of transistors made with the same ...

Efficient Power Conversion Corporation extends its family of high-speed, high performance transistors with the EPC8010 power transistor. Sold in die form, the EPC8010 is a mere 1.75 mm2 with 100 VDS.