With the pace of improvements in silicon slowing, power MOSFET manufacturers continue to focus their attention on device packaging. Engineers attending this month's industry events — the Electronica ...
Low-voltage PowerMOSFETs have taken over numerous applications in the automotive field, e.g, for motor control, DC/DC converters or reverse polarity protection, in the power train, body or chassis ...
An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
BERLIN—The Eurofighter partner nations and industry have sealed a long-awaited contract to develop the next capability enhancement package for the four-nation combat aircraft. The Phase 4 Enhancements ...
Ambler, Pa.—MEN Micro Inc. is offering development packages for M-Modules and PMCs that are designed to easily transform specialized I/O requirements into a series of standard products. MEN Micro is ...
A medical device's package plays a key role in safely delivering treatment to patients. It must ensure the integrity of the device from the point of manufacture to the point of final use. In addition, ...
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