Applied Materials Expands AI Packaging With NEXX Deal As Stock Surges

Applied Materials has agreed to acquire the NEXX business from ASMPT Limited, expanding its advanced packaging tools for AI ...

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...

Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX

Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...
Seeking Alpha

ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool

New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels FREMONT, Calif., Sept. 03, 2024 ...
Nasdaq

ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool for Chiplets

FREMONT, Calif., July 29, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
TweakTown

TSMC exploring 'radically new' semiconductor packaging technique called panel-level packaging

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...
Seeking Alpha

SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging with Formats up to 700×700mm to Leading U.S. Technology Company

FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...
USA Today

Silicon Box Ships 100M Units, Proves Advanced Panel-Level Packaging Ready for AI, HPC era

Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...
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Applied Materials to acquire NEXX in AI packaging expansion

Applied Materials has agreed to acquire the NEXX business from ASMPT Limited to expand its panel-level advanced packaging technologies for AI chips. The deal, which requires no regulatory approval, is ...