The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...

SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) applications with formats of up to 700×700mm to a leading U ...

In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech ...

Memory packaging and testing company Powertech Technology Inc. (PTI) has heavily invested in fan-out panel-level packaging (FOPLP) in recent years. Chairman DK Tsai stated that the new FOPLP products ...

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

CARLSBAD, Calif.--(BUSINESS WIRE)-- Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) ...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.