One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

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[youtube=http://www.youtube.com/v/c_Qt5CtUlqY&hl=en_US&fs=1&] Take a few minutes to watch this amazingly informative video on how to solder QFN or MLF components ...

Taiwan suppliers of B2B networking chips are moving to adopt QFN technology for packing their products amid the growing shortage of substrates for FC (flip-chip) production, increasing business ...

The new QFN socket from Ironwood Electronics features a unique contact design with outside spring and flat stamped plungers. The CBT-QFN-7056 provides a robust solution for burn-in and test ...

You can achieve a lot with a Dremel. For instance, apparently you can slim the original NES down into the hand-held form-factor. Both the CPU and the PPU (Picture Processing Unit) are 40-pin DIP chips ...

MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a ...

SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

With over 200 million motors produced every year with fractional horse power, the opportunity to save energy by adopting an electronically controlled variable speed solution is very significant. In ...