For CMOS logic, SOI (silicon-on-insulator) technology offers significant advantages over bulk silicon at the same geometry. Manufacturers have demonstrated those advantages using device-level ...
To reduce die size by up to 40 percent, Erfurt, Germany-based analog/mixed-signal foundry X-FAB Semiconductor Foundries AG Tuesday announced XT06, its 0.6-micrometer silicon-on-insulator (SOI) CMOS ...
NEWPORT BEACH, Calif.--(BUSINESS WIRE)--TowerJazz, the global specialty foundry leader, today announced the availability of enhanced RF SOI CMOS and high speed SiGe process design kits (PDKs) for its ...
Debuting as the market’s first 10-Gb Ethernet physical-layer large-scale integration (LAN-PHY LSI) transceiver designed using a combination of silicon-on-insulator and complementary metal-oxide ...
ZÜRICH, Switzerland, April 04, 2024 (GLOBE NEWSWIRE) -- QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, is proud to announce the launch of its innovative QWX27105 single ...
The next-generation 4G wireless standard known as long-term evolution (LTE) presents some new and difficult design choices for OEMs. One of the more difficult choices involves the less glamorous, but ...
CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated at 400°C. The devices match ...
GENEVA and GRENOBLE, FRANCE--(Marketwire - Oct 18, 2012) - STMicroelectronics (NYSE: STM), Soitec (Euronext) and CMP (Circuits Multi Projets®) today announced that ST's CMOS 28nm Fully Depleted ...
Renesas claims faster, lower power SOI CMOSNews from ElectronicNews OnlineJapanese memory chipmaker Renesas Technology said it has developed silicon-on-insulator (SOI) CMOS device technology that is ...
“This paper presents a 40 GHz voltage-controlled oscillator (VCO) and frequency divider chain fabricated in STMicroelectronics 28 nm ultrathin body and box (UTBB) fully depleted silicon-on-insulator ...
ROUSSET, FRANCE and GRENOBLE, FRANCE--(Marketwire - Mar 7, 2013) - STMicroelectronics (NYSE: STM) and CMP (Circuits Multi Projets®) today announced that ST's H9A CMOS process (at 130nm lithography ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results