TAIPEI (Taiwan News) — Demand for artificial intelligence chips is accelerating growth across the semiconductor industry, ...

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

KLA KLAC is benefiting from strong advanced packaging growth as demand for more powerful chips continues to grow. The ...

ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...

Semiconductor Fabrication Material Market 2026 Expanding Alongside Global Chip Production. EINPresswire/ -- The semiconductor fabrication material market is dominated by a mix of global chemical ...

This semiconductor giant is quietly powering the AI boom.

Industry-leaders will create hub for R&D with prototype production line for 515 x 510mm panel-level organic interposers Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as ...