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SiGen Continues its Focus on Customer Specific 3DIC Applications Using NanoTec and NANOCLEAVE™ Layer Transfer Technology

Silicon Genesis Corporation (SiGen), a leader in process technology and equipment for engineered substrates provides ongoing support to its customers and licensees. Since SiGen’s 3DIC announcement ...
abc27

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE(TM) Layer Transfer Process

SiGen collaborates closely with its customers by using its Customer Specific Substrate (CSS) development approach to work on application specific products. CSS is one of the most effective approaches ...
KOIN 6

Silicon Genesis Extends Its NANOCLEAVE Layer Transfer Technology with New 3DIC Initiatives

Silicon Genesis is a leading provider of engineered substrate process technology and equipment for the semiconductor, display, and optoelectronics markets. SiGen’s technology is used for production of ...
WRIC

Silicon Genesis Broadens the Use of Layer Transfer Methods for Advanced CMOS Image Sensor Stacks

Figure1: Cross-section-TEM image of an active photodiode (PD) layer transferred to a model signal transfer device (labeled here as a "mount" device). Image taken before subsequent removal of cleave ...
WOOD-TV

Silicon Genesis Enhances 3DIC Integration with Breakthrough in NanoCleave™ Ultra-Thin Layer Transfer Technology

NanoCleave™ enables transfer of 140nm ultra-thin silicon layers for cost-effective sustainable alternative to Temporary-Bond/Grind-Back/Layer-Release processes ...