A new research review looks at how computer vision and machine learning could be used to spot defects in 3D printed concrete.

Defect-engineered zinc oxide converts tiny reversible strains into near-infrared light, opening a rare-earth-free path to ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

A new wafer inspection platform combines AI analytics, sub-micron imaging, SWIR sensing, and precision metrology to help ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...