TL;DR: NVIDIA's B300 AI chip production is accelerated to May, utilizing TSMC's advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs, the B300 aims to ...

TL;DR: TSMC's advanced 3nm and 5nm process nodes are fully booked through 2026, driven by strong demand from AI, cloud, and HPC applications. Major tech firms like Apple, Qualcomm, NVIDIA, and AMD ...

TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC makers and ...

Showcasing TSMC’s latest offerings for high performance computing, smartphone, automotive, and IoT applications SANTA CLARA, Calif.--(BUSINESS WIRE)-- TSMC (TWSE: 2330, NYSE: TSM) today unveiled its ...

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT) giants ASE and ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

Keysight’s Electromagnetic Simulator and Synopsys’ AI-powered RF design migration flow, provide an efficient, integrated radio frequency circuit re-design solution Enhanced integrated flow leverages ...

Synopsys has achieved first-pass silicon success using TSMC’s N2 process and certified digital and analog EDA (electronic design automation) flows for TSMC’s A16 and N2P technologies. The company said ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

TSMC’s 3nm and 5nm chip capacity is expected to be fully booked through 2026 as Apple, NVIDIA, Qualcomm, and AMD secure orders for next-gen processors. Rising AI demand and limited supply may lead to ...