Rohm Semiconductor has added a new thermal analysis function its Solution Simulator, enabling automotive and industrial circuit and system designers to verify power device and driver IC thermal issues ...
New Software Development Kit Brings High-Performance Thermal Simulation And GPU-Accelerated Speed To Integrated Engineering Workflows. MONTREAL, /CNW/ - Maya HTT today announced the launch of the ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
Some of the important trends driving EV development are getting more than 200 miles out of a charge, pricing below $40,000, fast charging such as less than 30 minutes for an 80% charge, increasing ...
The drive for better efficiency in the power electronics industry has generated enormous gains in the last few years. The design of power semiconductors has improved, silicon carbide (SiC) and gallium ...
Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...
Watch back our March 4 webinar exploring the latest in battery simulation and modelling with industry leaders COMSOL.
The level of difficulty in designing electro-technique devices has increased, owing to thermal stress. With the development of electric vehicles and electric aircraft, and to keep up with the recent ...
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