EDN

Wafer-level packaging group to open line in China

SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...
EDN

Wafer-level packaging group sets up 300-mm line

SAN FRANCISCO — The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) today (July 3) announced it has installed a 300-mm wafer bumping and wafer-level packaging line at Unitive ...
Yahoo Finance

The Global Fan-out Wafer Level Packaging Market is forecast to grow by $3064.31 mn during 2022-2027, accelerating at a CAGR of 17.5% during the forecast period

New York, Feb. 06, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Fan-out Wafer Level Packaging Market 2023-2027" - https://www ...
Semiconductor Engineering

One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging Using a Photosensitive Dielectric Material

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...
Digi Times

Samsung steps up fan-out wafer-level packaging deployment

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
Semiconductor Engineering

Fan-Out Wafer-Level Packaging And Copper Electrodeposition

As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and ...
Yahoo Finance

Global Wafer Level Packaging Market Report 2022 to 2028: Players Include ASML Holdings, Fujitsu, Toshiba, Qualcomm and Amkor Technology

Dublin, Nov. 22, 2022 (GLOBE NEWSWIRE) -- The "Global Wafer Level Packaging Market Size, Share & Industry Trends Analysis Report By End User, By Type, By Regional Outlook and Forecast, 2022 - 2028" ...
Nasdaq

ACM Research Highlights Availability of Portfolio of Wafer-Level Packaging Processing Equipment for OSAT Customers

Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...
Digi Times

TSMC's wafer manufacturing 2.0 reshapes advanced packaging market

TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced packaging ...
PR Newswire

Global Fan-Out Wafer Level Packaging Market to Reach USD 6.98 Billion by 2031 -- Driven by Next-Gen Semiconductor Innovations | Valuates Reports

BENGALURU, India, Oct. 21, 2025 /PRNewswire/ -- Fan-Out Wafer Level Packaging Market is Segmented by Type (High Density Fan-Out Package, Core Fan-Out Package), by Application (CMOS Image Sensor, A ...
Yahoo Finance

ASE developing square packaging substrate tech to replace round wafers

ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with square substrates, which promises to increase the company's advanced ...