Nasdaq

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...
Nasdaq

ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today ...
Seeking Alpha

ASE Technology: The Next Era Of Advanced Packaging Is Here

ASE Technology remains well-positioned to benefit from persistent advanced packaging bottlenecks, especially as TSMC’s capacity expansion still lags demand. ASX’s diversified customer base and rapid ...
Business Wire

ASE’s Bumping Factory in Kaohsiung, Taiwan inducted into the World Economic Forum’s Global Lighthouse Network

KAOHSIUNG, Taiwan--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX), announced today that its bumping factory in ...
Seeking Alpha

ASE Technology: Powering The Future Of Semiconductors With Innovation And Global Scale

As the benefits of Moore's law reach their limits, advances in chip performance turn to the back end of production. Back-end semiconductor processing is booming due to limits in front-end innovation.