Semiconductor Engineering

Breakthrough Thin GaN Chiplet Technology

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...

Here's the Real Reason SpaceX Is Teaming Up With Intel on Terafab

An Intel blog post highlighted exciting technology SpaceX may need to use.
HotHardware

Intel Touts Breakthrough With World's Thinnest GaN Chiplet For AI Chips

Intel has unveiled a Gallium Nitride (GaN) chiplet measuring a mere 19 micrometers in thickness. First showcased at the IEEE International Electron Devices Meeting in December last year, this ...
Fudzilla

Intel shows off ultra-thin GaN chiplet for data centres

Intel is showing off a wafer-thin trick that could shake up power-hungry kit. The chipmaker’s foundry boffins have built what they claim is the world’s thinnest GaN chiplet at just 19 micrometres.
Digi Times

Intel unveils ultra-thin GaN chiplet as it advances AI-era systems foundry strategy

Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the world's thinnest GaN chiplet as part of its broader push to position itself ...
Semiconductor Engineering

Replay‑based Validation as a Scalable Methodology for Chiplet‑based Systems (Intel, Synopsys)

A new technical paper, “ODIN-Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation,” was published by researchers at Intel, Nvidia and Synopsys. “Integration of CPU and GPU ...
Hosted on MSN

Intel’s 288-core Xeon 6+ targets AI edge

Intel has introduced its Xeon 6+ “Clearwater Forest” processors at MWC 2026, bringing up to 288 efficient cores in a multi-chiplet design aimed at AI-ready network and cloud environments. The chips ...
Blockonomi

Intel (INTC) Stock Soars 70% on Google Partnership and Terafab Collaboration

Intel (INTC) stock is up 70% in 2026 after strengthening its Google Cloud AI partnership and joining Elon Musk's Terafab chip venture with SpaceX.