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Microchip Technology Inc. has introduced the 3.3-kV XIFM plug-and-play mSiC gate driver to help developers implement silicon-carbide (SiC) solutions as electrification drives the widespread adoption ...
CHANDLER, Ariz., Feb. 20, 2024 (GLOBE NEWSWIRE) -- The electrification of everything is driving the widespread adoption of Silicon Carbide (SiC) technology in medium-to-high-voltage applications like ...
Microchip is releasing its BZPACK mSiC power modules, designed to meet High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. They are available in topologies including ...
CHANDLER, Ariz., March 19, 2026 (GLOBE NEWSWIRE) -- Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules , designed to meet stringent High Humidity High Voltage High ...
The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families CHANDLER, Ariz., March 19, 2026 (GLOBE NEWSWIRE) -- ...
Microchip Technology announced its BZPACK mSiC power modules, designed to meet stringent high-humidity high-voltage high-temperature reverse bias (HV‑H3TRB) standards. BZPACK modules can deliver ...
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