Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...

Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...

Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

Energy/bit optimization approach for multi-chip systems with possibility of co-optimization with the routing resources defined by the signalling pitch. December 7th, 2022 - By: Fraunhofer IIS/EAS More ...

A new job posting from SpaceX mentions the company wants to develop compact 'multi-chip modules' to handle radio frequencies for Starlink Mobile.

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

The collaboration focuses on IoT and connected devices, with certified modules built using Nordic’s low-power chip technology ...

ELMSFORD, N.Y.--(BUSINESS WIRE)--SEEQC, the digital quantum computing company, today introduced a family of high speed, energy-efficient Single Flux Quantum (SFQ) digital chips capable of running all ...

The higher-bandwidth, lower-latency and higher-reliability requirements of 5G mobile networks drive the need for higher-performance, higher-efficiency and lower-power–consumption 5G chips and modules.

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

The printed circuit board has been around so long, it just can’t be in danger of being phased out, right? Well, if you have been paying attention to the increasing tendency to put electronic devices ...

India’s first commercially packaged multi-chip module (MCM) was rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand in the wee hours of Wednesday and ...