TL;DR: NVIDIA's B300 AI chip production is accelerated to May, utilizing TSMC's advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs, the B300 aims to ...

Synopsys has achieved first-pass silicon success using TSMC’s N2 process and certified digital and analog EDA (electronic design automation) flows for TSMC’s A16 and N2P technologies. The company said ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving a data rate of ...

Certified digital and analog flows on the TSMC N2P and A16™ processes using TSMC NanoFlex™ architecture boost performance and speed analog design migration 3DIC Compiler platform and 3D-enabled IP ...

TL;DR: TSMC's advanced 3nm and 5nm process nodes are fully booked through 2026, driven by strong demand from AI, cloud, and HPC applications. Major tech firms like Apple, Qualcomm, NVIDIA, and AMD ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

Showcasing TSMC’s latest offerings for high performance computing, smartphone, automotive, and IoT applications SANTA CLARA, Calif.--(BUSINESS WIRE)-- TSMC (TWSE: 2330, NYSE: TSM) today unveiled its ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on TSMC's N5 process ...

Synopsys, Inc. SNPS is advancing its role in semiconductor design by expanding its collaboration with Taiwan Semiconductor Manufacturing Company TSM, also known as TSMC. The partnership focuses on ...

Despite market speculation of a major reduction in Nvidia Corporation's (NASDAQ:NVDA) 2025 Chip-On-Wafer-On-Substrate (CoWoS) wafer orders at Taiwan Semiconductor Manufacturing Co (NYSE:TSM), renowned ...